 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| HSMF-C15x Bi-color Surface Mount Chip LEDs Data Sheet HSMF-C153/C155/C156/C157/C158 Description The HSMF-C15x series of bicolor chip-type LEDs isdesignedinanindustrystandardpackageforeaseofhandling and use. These bicolor LEDs are available as high efficiency red/yellow, high efficiency red/green, yellow/ green, orange/green and green/amber. The HSMF-C15x hasthewidelyused3.2x2.7mmfootprintandwideviewinganglemakethisLEDexceptionalforbacklightingapplications. Allpackagesarecompatiblewithreflowsolderprocesses. ThesmallsizeandwideviewinganglemaketheseLEDs primechoicesforbacklightingapplicationsandfrontpanelindicatorsespeciallywherespaceisapremium. Features * * * * * * Smallsize Industrystandardfootprint CompatiblewithIRsolder Diffusedoptics Operatingtemperaturerangeof-30Cto+85C Fivecolorcombinationsavailable: Red/Yellow,Red/Green,Yellow/Green, Orange/GreenandGreen/Amber. * Available in 8 mm tape on 7 in. (178 mm) diameter reels Applications * * * * Push-buttonbacklighting Symbolbacklighting Statusindicator Frontpanelindicator Device Selection Guide Part Number Parts per Reel Color Package Description HSMF-C153 HSMF-C155 HSMF-C156 HSMF-C157 HSMF-C158 3000 3000 3000 3000 3000 GaP Yellow / GaP HER GaP HER / GaP Green GaP Yellow / GaP Green GaP Orange / GaP Green AlInGaP Green / AlInGap Amber Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused CAUTION: HSMF-C15x LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Package Dimensions HSMF-C153/C155/C156/C157/C158 LED DIE CATHODE MARK 2 1.4 (0.055) 3 4 2.7 (0.106) 1 3.2 (0.126 ) 2.00 (0.079) 0.60 (0.024) DIFFUSED EPOXY PC BOARD 1.10 (0.043) 0.50 (0.020) 0.55 (0.022) R 0.25 (0.010) TYP. 0.55 (0.022) SOLDERING TERMINAL 1.10 (0.043) 0.40 (0.016) 4 0.05 (0.002) MAX. CATHODE LINE NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED. POLARITY 1 3 2 4 HSMF-C153 HSMF-C155 HSMF-C156 HSMF-C157 HSMF-C158 Yellow HER Green HER Green Yellow Green Orange Green Amber 2 Absolute Maximum Ratings at TA = 25C Parameter GaP AlInGaP Green AlInGaP Amber Units DC Forward Current [1] Power Dissipation [2] Reverse Voltage (IR = 100mA) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature 20 65 5 95 20 52 5 95 -30 to 85 C -40 to 85 C 25 60 5 95 mA mW V C See reflow soldering profile (Figure 6 & 7) Notes: 1. DeratelinearlyasshowninFigure4fortemperatureabove25C. 2. Pulseconditionof1/10dutyand0.1msec.width. Optical Characteristics at TA = 25C Luminous Intensity IV [1] (mcd) @ 20mA Part Number Min. Typ. Color, Peak Wavelength ld (nm) Typical Color, Dominant Wavelength ld [2] (nm) Typical Viewing Angle 2q1/2 [3] (Degrees) Typical GaP HER GaP Yellow GaP Green GaP Orange AlInGaP Green AlInGap Amber 2.50 2.50 4.00 2.50 28.50 28.50 10.0 8.0 15.0 8.0 45.0 55.0 630 589 570 605 570 595 626 586 572 604 572 592 170 170 170 170 170 170 Notes: 1. TheluminousintensityIVismeasuredatthepeakofthespatialradiationpatternwhichmaynotbealignedwiththemechanicalaxisoftheLED package. 2. Thedominantwavelength,ld,isderivedfromtheCIEChromaticityDiagramandrepresentstheperceivedcolorofthedevice. 3. l1/2istheoff-axisanglewheretheluminousintensityis1/2thepeakintensity. Electrical Characteristics at TA = 25C Forward Voltage VF (Volts) [1] @ IF = 20mA Part Number Typ. Max. Reverse Breakdown VR (Volts) @ IR = 100mA Min. Capacitance C (pF) @VF = 0, f = 1Mhz Typ. Thermal Resistance RJ-P (C/W) Typ. GaP HER GaP Yellow GaP Green GaP Orange AlInGaP Green AlInGap Amber 2.1 2.1 2.2 2.2 2.1 1.9 2.6 2.6 2.6 2.6 2.4 2.4 5 5 5 5 5 5 5 6 9 7 22 45 325 325 325 325 325 325 Notes:Thebicolorpackagecontaintwoindividuallightsourcesofdifferentcolor.Thespecificationsaboverefertoeachcolorofaparticularpackage. 3 Color Bin Limits GaP HER Color Bins [1] Dominant Wavelength (nm) Bin ID Minimum Maximum Bin ID GaP Green Color Bins [1] Dominant Wavelength (nm) Minimum Maximum Tolerance : 1nm 620.0 635.0 A B C D E Tolerance : 1nm 561.5 564.5 567.5 570.5 573.5 564.5 567.5 570.5 573.5 576.5 GaP Yellow / AlInGaP Amber Color Bins [1] Dominant Wavelength (nm) Bin ID Minimum Maximum A B C D E F Tolerance : 1nm 582.0 584.5 587.0 589.5 592.0 594.5 584.5 587.0 589.5 592.0 594.5 597.0 AlInGaP Green Color Bins [1] Dominant Wavelength (nm) Bin ID Minimum Maximum A B C D E 561.5 564.5 567.5 570.5 573.5 564.5 567.5 570.5 573.5 576.5 GaP Orange Color Bins [1] Dominant Wavelength (nm) Bin ID Minimum Maximum Tolerance : 1nm A B C D E F Tolerance : 1nm 597.0 600.0 603.0 606.0 609.0 612.0 600.0 603.0 606.0 609.0 612.0 615.0 4 Light Intensity (Iv) Bin Limits[1] Intensity (mcd) Bin ID Min. Max. Bin ID Intensity (mcd) Min. Max. A B C D E F G H J K L M Tolerance:15%. 0.11 0.18 0.29 0.45 0.72 1.10 1.80 2.80 4.50 7.20 11.20 18.00 0.18 0.29 0.45 0.72 1.10 1.80 2.80 4.50 7.20 11.20 18.00 28.50 N P Q R S T U V W X Y 28.50 45.00 71.50 112.50 180.00 285.00 450.00 715.00 1125.00 1800.00 2850.00 45.00 71.50 112.50 180.00 285.00 450.00 715.00 1125.00 1800.00 2850.00 4500.00 Note: 1.Bincategoriesareestablishedforclassificationofproducts.Productsmaynotbeavailablein allcategories.PleasecontactyourAvagorepresentativeforinformationoncurrentlyavailable bins. 1.0 GREEN RELATIVE INTENSITY YELLOW 0.5 ORANGE HER 0 500 550 600 650 700 750 WAVELENGTH - nm Figure 1. Relative intensity vs. wavelength. 5 100 IF - FORWARD CURRENT - mA LUMINOUS INTENSITY (NORMALIZED AT 20 mA) IF MAX. - MAXIMUM FORWARD CURRENT - mA 1.6 35 30 25 20 15 10 5 0 0 20 40 60 80 100 RJ-A = 600C/W RJ-A = 800C/W 10 HER GREEN 1.2 0.8 1 YELLOW 0.1 ORANGE 1.5 1.7 1.9 2.1 2.3 VF - FORWARD VOLTAGE - V 0.4 0 0 10 20 30 40 IF - FORWARD CURRENT - mA TA - AMBIENT TEMPERATURE - C Figure 2. Forward current vs. forward voltage. Figure 3. Luminous intensity vs. forward current (all colors). Figure 4. Maximum forward current vs. ambient temperature. 1.00 0.90 RELATIVE INTENSITY - % 0.80 0.70 0.60 TEMPERATURE 10 SEC. MAX. 230 MAX. C 140-160C 4C/SEC. MAX. OVER 2 MIN. TIME 4C/SEC. MAX. 3C/SEC. MAX. 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5. Relative intensity vs. angle for HSMF-C153, C155, C156, C157 and C158. Figure 6. Recommended reflow soldering profile. 10 - 30 SEC. TEMPERATURE 217C 200C 150C 255 - 260 C 3 C/SEC. MAX. 6 C/SEC. MAX. 3 C/SEC. MAX. 60 - 120 SEC. TIME 100 SEC. MAX. 1.0 (0.039) 0.4 (0.016) 1.0 (0.039) 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) (Acc. to J-STD-020C) Note: 1. All dimensions in millimeters (inches). Figure 8. Recommended solder pad pattern. Figure 7. Recommended Pb free reflow soldering profile. USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 9. Reeling orientation. 8.0 1.0 (0.315 0.039) 20.20 MIN. 10.50 1.0 (0.413 0.039) ( 0.795 MIN.) 13.1 0.5 ( 0.516 0.020) 3.0 0.5 (0.118 0.020) 178.40 1.00 (7.024 0.039) 59.60 1.00 (2.346 0.039) 4.0 0.5 (0.157 0.020) 6 PS 5.0 0.5 (0.197 0.020) Note: All dimensions in millimeters (inches). Figure 10. Reel dimensions. 7 4.00 (0.157) 1.50 (0.059) CATHODE DIM. C (SEE TABLE 1) 0.20 0.05 (0.008 0.002) 1.75 (0.069) 3.50 0.05 (0.138 0.002) DIM. A (SEE TABLE 1) 8.00 0.30 (0.315 0.012) CARRIER TAPE COVER TAPE DIM. B (SEE TABLE 1) 2.00 0.05 (0.079 0.002) USER FEED DIRECTION 4.00 (0.157) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER HSMF-C15x SERIES DIM. A DIM. B DIM. C 0.10 (0.004) 0.10 (0.004) 0.10 (0.004) 3.52 (0.139) 3.02 (0.119) 1.40 (0.055) Figure 11. Tape dimensions. END START Convective IR Reflow Soldering FormoreinformationonIRreflow soldering,refertoApplicationNote 100,Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 30C @ 60% RH max. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 12. Tape leader and trailer dimensions. Bakingisrequiredunderthe condition: a) HumidityIndicatorCardis >10%whenreadat235C b) Deviceexposedtofactoryconditions<30C/0%RHmorethan 72hours. Bakingrecommendedcondition: 05Cfor20hours. Notes: 1.Alldimensionsinmillimeters(inches). 2.Toleranceis0.1mm(0.004in.)unlessotherwisespecified. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright (c) 2008 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0671EN AV02-0427EN - February 20, 2008 |
Price & Availability of HSMF-C153
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |